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Cooper C.

PaperTitlePage
TUP49ECR Plasma Cleaning: An In-situ Processing Technique for RF Cavities243
 
  • G. Wu, H. Jiang, T. Khabiboulline, I. Pechenezhskiy, T. Koeth, J. Reid, W. Muranyi, B. Tennis, E. Harms, Y. Terechkine, H. Edwards, D. Mitchell, A. Rowe, C. Boffo, C. Cooper, L. Cooley, R. Schuessler
    Fermilab
  • W. -D. Moeller
    DESY Hamburg
  • C. Antoine
    CEA-Saclay
  • A. Romanenko
    Cornell University
 
 A condition for Electron Cyclotron Resonance (ECR) can be established inside a fully assembled RF cavity without the need for removing high-power couplers. As such, plasma generated by this process can be used as a final cleaning step, or as an alternative cleaning step in place of other techniques. We will describe the current effort to study plasma cleaning by ECR in a 3.9GHz cavity. 
TUP70Optimization of BCP Processing of Elliptical NB SRF Cavities308
 
  • C. Cooper, G. Galasso, A. Rowe
    Fermilab
  • C. Boffo
    Babcock Noell GmbH
 
 At present, electropolishing (EP) is considered a key technology in fabricating Nb SRF cavities performing at or above 35 MV/m. Nevertheless buffer chemical polishing (BCP) is still a cheaper, simpler and effective processing technique for single grain high gradient and polycrystalline lower gradient cavities. BCP has also been adopted to chemically process the third harmonic 3.9 GHz cavities, operating at or above 14 MV/m, being fabricated at Fermilab [1]. The dimensions and the shape of these cavities pose the problem of uneven material removal between iris and equator of the cells. This paper describes the thermal-fluid finite element model adopted to simulate the process, the experimental flow visualization tests performed to verify the simulation and a novel device fabricated to solve the problem.