Author: Xiao, O.
Paper Title Page
THPO102 Design Studies of Output Window for CEPC Klystron 911
 
  • Z.J. Lu, Y.L. Chi, S. Fukuda, G. Pei, S. Pei, S.C. Wang, O. Xiao, U. N. Zaib, Z.S. Zhou
    IHEP, Beijing, People’s Republic of China
  • S. Fukuda
    KEK, Ibaraki, Japan
 
  A high power and high efficiency klystron of the 650MHz, 800kW CW klystron for the Circular Electron Positron Collider (CEPC) is designed and developed at IHEP. This paper presents the design and simulation for the high power coaxial window for it. Plan of the hot test (high power testing before installing to the klystron) are also described. Simulation software of CST, ANSYS and Multipac 2.1 are used for design of window microwave structure, thermal analysis and multipacting effects. We obtained the good simulation results successively; the coaxial window S-parameter analysis, has revealed a low reflection at the operating frequency of 650 MHz. The thermal simulation shows a good temperature distribution under the cw 800kW propagation; maximum temperature has been found to be 33 °C at ceramic with water cooling in the inner and outer conductor. The multipacting at the window is possible source of the failure and it is shown that multipacting has less chance to be happened on the surface of ceramic.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-LINAC2018-THPO102  
About • paper received ※ 12 September 2018       paper accepted ※ 31 October 2018       issue date ※ 18 January 2019  
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THPO103 Application of Solid State Amplifiers in ADS Project at IHEP 914
 
  • O. Xiao
    Institute of High Energy Physics (IHEP), People’s Republic of China
  • Y.L. Chi, N. Gan, X. Ma, Z.S. Zhou
    IHEP, Beijing, People’s Republic of China
 
  The solid state amplifier is an important part of the RF power source system of ADS project at IHEP. Three kinds of solid state amplifier with different power and frequency have been applied. In this paper, the specifications of solid state amplifier are presented. In addition, the principle of breakdown of power modules during the high power test of coupler are analyzed.  
poster icon Poster THPO103 [0.195 MB]  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-LINAC2018-THPO103  
About • paper received ※ 17 September 2018       paper accepted ※ 20 September 2018       issue date ※ 18 January 2019  
Export • reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)