Author: Xiao, O.
Paper Title Page
THPO102 Design Studies of Output Window for CEPC Klystron 911
 
  • Z.J. Lu, Y.L. Chi, S. Fukuda, G. Pei, S. Pei, S.C. Wang, O. Xiao, U. N. Zaib, Z.S. Zhou
    IHEP, Beijing, People’s Republic of China
  • S. Fukuda
    KEK, Ibaraki, Japan
  
  A high power and high ef­fi­ciency kly­stron of the 650MHz, 800kW CW kly­stron for the Cir­cu­lar Elec­tron Positron Col­lider (CEPC) is de­signed and de­vel­oped at IHEP. This paper pre­sents the de­sign and sim­u­la­tion for the high power coax­ial win­dow for it. Plan of the hot test (high power test­ing be­fore in­stalling to the kly­stron) are also de­scribed. Sim­u­la­tion soft­ware of CST, ANSYS and Mul­ti­pac 2.1 are used for de­sign of win­dow mi­crowave struc­ture, ther­mal analy­sis and mul­ti­pact­ing ef­fects. We ob­tained the good sim­u­la­tion re­sults suc­ces­sively; the coax­ial win­dow S-pa­ra­me­ter analy­sis, has re­vealed a low re­flec­tion at the op­er­at­ing fre­quency of 650 MHz. The ther­mal sim­u­la­tion shows a good tem­per­a­ture dis­tri­b­u­tion under the cw 800kW prop­a­ga­tion; max­i­mum tem­per­a­ture has been found to be 33 °C at ce­ramic with water cool­ing in the inner and outer con­duc­tor. The mul­ti­pact­ing at the win­dow is pos­si­ble source of the fail­ure and it is shown that mul­ti­pact­ing has less chance to be hap­pened on the sur­face of ce­ramic.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-LINAC2018-THPO102  
About • paper received ※ 12 September 2018       paper accepted ※ 31 October 2018       issue date ※ 18 January 2019  
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THPO103 Application of Solid State Amplifiers in ADS Project at IHEP 914
 
  • O. Xiao
    Institute of High Energy Physics (IHEP), People’s Republic of China
  • Y.L. Chi, N. Gan, X. Ma, Z.S. Zhou
    IHEP, Beijing, People’s Republic of China
  
  The solid state am­pli­fier is an im­por­tant part of the RF power source sys­tem of ADS pro­ject at IHEP. Three kinds of solid state am­pli­fier with dif­fer­ent power and fre­quency have been ap­plied. In this paper, the spec­i­fi­ca­tions of solid state am­pli­fier are pre­sented. In ad­di­tion, the prin­ci­ple of break­down of power mod­ules dur­ing the high power test of cou­pler are an­a­lyzed.  
poster icon Poster THPO103 [0.195 MB]  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-LINAC2018-THPO103  
About • paper received ※ 17 September 2018       paper accepted ※ 20 September 2018       issue date ※ 18 January 2019  
Export • reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)