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We outline a model of breakdown in rf cavities. Breakdown can be triggered by two mechanisms, one is fracture of the surface due to the tensile stress produced by the electric field, the second is Ohmic heating at grain boundaries and defects at very high current densities. We show how this model follows from measurements of local electric fields using electron field emission, and show how the model applies to the operating conditions of a variety of rf structures. This model may have some relevance to SCRF and DC structures.
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