Paper | Title | Page |
---|---|---|
SUPFDV009 | Thermal Annealing of Sputtered Nb3Sn and V3Si Thin Films for Superconducting RF Cavities | 82 |
|
||
Funding: U.S. National Science Foundation under Award PHY-1549132, the Center for Bright Beams and Cornell Center for Materials Research Shared Facilities supported through the NSF MRSEC program (DMR-1719875) Nb3Sn and V3Si thin films are alternative material candidates for the next-generation of superconducting radio frequency (SRF) cavities. However, past sputtered films suffer from stoichiometry and strain issues during deposition and post annealing. As such, we aim to explore the structural and chemical effects of thermal annealing, both in-situ and post-sputtering, on DC-sputtered Nb3Sn and V3Si with varying thickness on Nb or Cu substrates. We successfully enabled recrystallization of 100 nm thin Nb3Sn films with stoichiometric and strain-free grains at 950 C annealing. For 2 um films, we observed removal of strain and slight increase in grain size with increasing temperature. A phase transformation from unstable to stable structure appeared on thick V3Si samples, while we observed significant Sn loss in thick Nb3Sn films at high temperature anneals. For films on Cu substrates, we observed similar Sn and Si loss during annealing likely due to Cu-Sn and Cu-Si phase generation and subsequent Sn and Si evaporation. These results encourage us to refine our process to obtain high quality films for SRF use. |
||
DOI • | reference for this paper ※ doi:10.18429/JACoW-SRF2021-SUPFDV009 | |
About • | Received ※ 22 June 2021 — Revised ※ 06 July 2021 — Accepted ※ 12 August 2021 — Issue date ※ 17 March 2022 | |
Cite • | reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml) | |
WEOTEV03 | Toward Stoichiometric and Low-Surface-Roughness Nb3Sn Thin Films via Direct Electrochemical Deposition | 710 |
|
||
Reducing surface roughness and attaining stoichiometry of Nb3Sn superconducting films are required to push their superheating field to the theoretical limit in SRF cavities. As such, we explore direct electrochemical processes that minimize involving foreign elements to deposit high-quality Sn, Nb, and NbxSn films on Nb and Cu surfaces. These films are then thermally annealed to Nb3Sn. We find that smooth Sn pre-depositions via electroplating on Nb surfaces significantly reduce the average roughness of resultant Nb3Sn to 65 nm, with a dramatic reduction in power intensity at medium special frequencies. Structural and superconducting properties demonstrate a Nb3Sn A15 phase with a stoichiometry of 25 at% Sn. This process is being scaled-up to a 3.9 GHz cavity. Moreover, preliminary results on electroplating on Cu surface show that Nb plating undergoes a slow growth rate while subsequent Sn plating on the plated Nb surface can be controlled with varied thickness. The Nb plating process is currently being optimized. | ||
DOI • | reference for this paper ※ doi:10.18429/JACoW-SRF2021-WEOTEV03 | |
About • | Received ※ 09 July 2021 — Revised ※ 09 August 2021 — Accepted ※ 21 August 2021 — Issue date ※ 16 January 2022 | |
Cite • | reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml) | |