The Joint Accelerator Conferences Website (JACoW) is an international collaboration that publishes the proceedings of accelerator conferences held around the world.
TY - CONF AU - Okii, Y. AU - Kako, E. AU - Michizono, S. AU - Taguchi, J. AU - Takahashi, H. AU - Yamamoto, Y. AU - Yasutake, H. ED - Michel, Peter ED - Arnold, André ED - Schaa, Volker RW TI - R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR J2 - Proc. of SRF2019, Dresden, Germany, 30 June-05 July 2019 CY - Dresden, Germany T2 - International Conference on RF Superconductivity T3 - 19 LA - english AB - Power couplers for superconducting cavities are required to have both low-thermal conductivity and high-electrical conductivity, because high-thermal conductivity and low-electrical conductivity could generate unexpected increase for heat load. In order to combine these contrary properties, power couplers are made of stainless steel and plated with copper plating. As electrical conductivity of copper layer affects dynamic heat load, it is crucial to optimize plating processes. In this study, we investigated influences of plating parameters (i.e., thickness of copper layer, plating bath composition, bath temperature, heat-treatment conditions) on RRR by collaborative work among Nomura plating, CETD, and KEK. As a result, we obtained high-RRR samples with conditions noted below; (1) electroformed copper plate, (2) copper layer thickness of over 50 µm, and (3) heat-treatment at 200deg-1h, (4) other plating bath composition. In addition, we observed microstructures of several samples, then found that microstructures of copper layer are strongly related to RRR. In this paper, we will present the recent results for this investigation. PB - JACoW Publishing CP - Geneva, Switzerland SP - 278 EP - 281 KW - SRF KW - experiment KW - target KW - electron KW - ECR DA - 2019/08 PY - 2019 SN - "" SN - 978-3-95450-211-0 DO - doi:10.18429/JACoW-SRF2019-MOP083 UR - http://jacow.org/srf2019/papers/mop083.pdf ER -