| Paper |
Title |
Page |
| PR021 |
Hydrogen Q-disease and Electropolishing
|
427 |
| |
- T. Higuchi
Grad. Univ. Advanced Studies and Nomura Plating Co. Ltd., Okazaki
- K. Saito, Y. Yamazaki
KEK, Ibaraki
- T. Ikeda, S. Ohgushi
Nomura Plating Co. Ltd., Osaka
|
|
| PR022 |
Centrifugal Barrel Polishing of L-band Niobium cavities
|
431 |
| |
- T. Higuchi
Grad. Univ. Advanced Studies and Nomura Plating Co. Ltd., Okazaki
- K. Saito, Y. Yamazaki
KEK, Ibaraki
- T. Ikeda, S. Ohgushi
Nomura Plating Co. Ltd., Osaka
|
|
| PT019 |
R & D of Nb/Cu Clad Seamless cavities at KEK
|
523 |
| |
- K. Saito, T. Fujino, N. Hitomi, H. Inoue, Y. Yamazaki
KEK, Ibaraki
- V. Palmieri
INFN/LNL, Legnaro, Padova
- W. Singer
DESY, Hamburg
- P. Kneisel
TJNAF, Newport News, Virginia
- K. Ohara
Toshiba Co. Ltd., Tokyo
- S. Tsukada
Hitachi Cable Co. Ltd., Tsuchiura-shi
|
|