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RIS citation export for WEPRB011: PVD Depostion of Nb₃Sn Thin Film on Copper Substrate from an Alloy Nb₃Sn Target

AU  - Valizadeh, R.
AU  - Aliasghari, S.
AU  - Dawson, K.
AU  - Dhanak, V.R.
AU  - Hannah, A.N.
AU  - Malyshev, O.B.
AU  - Stenning, G.B.G.
AU  - Turner, D.
ED  - Boland, Mark
ED  - Tanaka, Hitoshi
ED  - Button, David
ED  - Dowd, Rohan
ED  - Schaa, Volker RW
ED  - Tan, Eugene
TI  - PVD Depostion of Nb₃Sn Thin Film on Copper Substrate from an Alloy Nb₃Sn Target
J2  - Proc. of IPAC2019, Melbourne, Australia, 19-24 May 2019
CY  - Melbourne, Australia
T2  - International Particle Accelerator Conference
T3  - 10
LA  - english
AB  - In this study we report on the PVD deposition of Nb₃Sn on Cu substrates with and without a thick Nb interlayer to produce Cu/Nb/Nb₃Sn and Cu/Nb₃Sn multilayer structures. The Nb₃Sn was sputtered directly from an alloy target at room and elevated temperatures. The dependence of the superconducting properties of the total structure on deposition parameters has been determined. The films have been characterized via SEM, XRD, EDX and SQUID magnetometer measurements. Analysis showed that the composition at both room and elevated temperature was within the desired stoichiometry of 24’25 at%. However, superconductivity was only observed for deposition at elevated temperature or post annealing at 650 °C. The critical temperature was determined to be in the range of 16.8 to 17.4 K. In the case of bilayer deposition, copper segregation from the interface all the way to the surface was observed.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 2818
EP  - 2821
KW  - niobium
KW  - cavity
KW  - site
KW  - interface
DA  - 2019/06
PY  - 2019
SN  - 978-3-95450-208-0
DO  - DOI: 10.18429/JACoW-IPAC2019-WEPRB011
UR  - http://jacow.org/ipac2019/papers/weprb011.pdf
ER  -