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TY - CONF AU - Hershcovitch, A. AU - Blaskiewicz, M. AU - Brennan, J.M. AU - Custer, A.X. AU - Erickson, M.Y. AU - Fischer, W. AU - McIntyre, G.T. AU - Poole, H.J. AU - Verdú-Andrés, S. ED - Boland, Mark ED - Tanaka, Hitoshi ED - Button, David ED - Dowd, Rohan ED - Schaa, Volker RW ED - Tan, Eugene TI - Novel Technique Ion Assisted In-Situ Coating of Long, Small Diameter, Accelerator Beam Pipes with Compacted Thick Crystalline Copper Film J2 - Proc. of IPAC2019, Melbourne, Australia, 19-24 May 2019 CY - Melbourne, Australia T2 - International Particle Accelerator Conference T3 - 10 LA - english AB - Although great progress was made with in-situ copper coating, by magnetron sputtering, to address the high room temperature resistivity, literature indicates that conventionally deposited thick copper films do not retain the same RF conductivity at cryogenic temperatures, since straightforward deposition tends to result in films with columnar structure and other lattice defects, which cause significant conductivity degradation at cryogenic temperatures. We utilize energetic ions for ion assisted deposition (IAD) to reduce lattice imperfections, for coating. IAD that can in-situ coat long small diameter tubes with compacted crystalline structure thick copper films has been developed. Moreover, development of techniques and devices can resurrect IAD for other applications, which have been impractical and/or not viable economically. Comparison of conductivity at cryogenic temperatures between straight magnetron physical vapor deposition and IAD will be presented. PB - JACoW Publishing CP - Geneva, Switzerland SP - 4301 EP - 4303 KW - cathode KW - lattice KW - cryogenics KW - vacuum KW - plasma DA - 2019/06 PY - 2019 SN - 978-3-95450-208-0 DO - DOI: 10.18429/JACoW-IPAC2019-THPTS080 UR - http://jacow.org/ipac2019/papers/thpts080.pdf ER -