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RIS citation export for THPTS036: Quench Detection and Diagnostic Systems for the Superconducting Circuits for the HL-LHC

AU  - Denz, R.
AU  - Blasco Serrano, D.
AU  - Calcoen, D.O.
AU  - De Matteis, E.
AU  - Froidbise, V.
AU  - Georgakakis, S.
AU  - Haas, S.
AU  - Mundra, S.
AU  - Podzorny, T.
AU  - Siemko, A.P.
AU  - Spasic, J.
AU  - Steckert, J.
ED  - Boland, Mark
ED  - Tanaka, Hitoshi
ED  - Button, David
ED  - Dowd, Rohan
ED  - Schaa, Volker RW
ED  - Tan, Eugene
TI  - Quench Detection and Diagnostic Systems for the Superconducting Circuits for the HL-LHC
J2  - Proc. of IPAC2019, Melbourne, Australia, 19-24 May 2019
CY  - Melbourne, Australia
T2  - International Particle Accelerator Conference
T3  - 10
LA  - english
AB  - The High Luminosity LHC project (HL-LHC) will incorporate a new generation of superconducting elements such as high field superconducting magnets based on Nb₃Sn conductors and MgB₂ based high temperature superconducting links for magnet powering. In addition, the HL-LHC will also feature new generations of NbTi based magnets. The proper protection and diagnostics of those elements require the development of a new generation of integrated quench detection and data acquisition systems as well as novel methods for quench detection. The next generation of quench detection systems is to a large extent software defined and serves at the same time as high performance data acquisition system. The contribution will discuss the specific needs of HL-LHC in terms of quench detection and present recent results from tests with prototype magnets. The contribution will show the implementation of new quench detection methods such as current derivative sensors. Measures for increasing the system dependability and easing its maintenance will be explained, as well as the improved supervision architecture using Ethernet based field-bus systems for fast data transmission.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 4183
EP  - 4186
KW  - dipole
KW  - luminosity
KW  - data-acquisition
KW  - radiation
KW  - electronics
DA  - 2019/06
PY  - 2019
SN  - 978-3-95450-208-0
DO  - DOI: 10.18429/JACoW-IPAC2019-THPTS036
UR  - http://jacow.org/ipac2019/papers/thpts036.pdf
ER  -