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TY - UNPB AU - Borrelli, S. AU - Bednarzik, M. AU - David, Ch. AU - Ferrari, E. AU - Gobbo, A. AU - Guzenko, V. AU - Hiller, N. AU - Ischebeck, R. AU - Orlandi, G.L. AU - Ozkan Loch, C. AU - Rippstein, B. AU - Schlott, V. ED - Liu, Zhengzheng ED - Lidia, Steven ED - McCausey, Amy ED - Schaa, Volker RW TI - A Novel Nanotechnology Based Wire Scanner for Sub-Micrometer Resolution Measurements of the Electron Beam Profile at SwissFEL J2 - Proc. of IBIC2017, Grand Rapids, MI, USA, 20-24 August 2017 C1 - Grand Rapids, MI, USA T2 - International Beam Instrumentation Conference T3 - 6 LA - english AB - SwissFEL wire-scanners (WSCs) are designed to provide minimally-invasive high resolution measurements of the electron beam profile and emittance during FEL operations. The wire-fork is equipped with two pairs of wires: 5um tungsten wire for high resolution measurements and 12.5 um Al(99):Si(1) wires for routine beam monitoring. The resolution limit is given by the wire diameter, a dimension in turn constrained to few micrometers by the wire manufacturing and mounting technique. An improvement of the WSC spatial resolution was triggered by the requirements for special SwissFEL machine operations and experimental applications where the beam transverse size will be at the sub-micrometer scale. In order to meet the resolution requirements, we make use of nanofabrication of sub-micrometer metallic stripes on a membrane by means of e-beam lithography. This presentation shall focus on the design, fabrication process and characterization of a high-resolution wire scanner prototype consisting of thin gold or nickel stripes with widths ranging from 2um down to 0.4um electroplated on a silicon nitride membrane. First results of the prototype electron beam tests will be also presented. PB - JACoW CP - Geneva, Switzerland ER -