| Paper | Title | Page |
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| WEPEC078 | Plasma Treatment of Niobium SRF Cavity Surfaces | 3058 |
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Plasma based surface modification provides an excellent opportunity to eliminate non-superconductive pollutants in the penetration depth region of the SRF cavity surface and to remove mechanically damaged surface layer improving surface roughness. We have demonstrated on flat samples that plasma etching in Ar/Cl2 of bulk Nb is a viable alternative surface preparation technique to BCP and EP methods, with comparable etching rates. The geometry of SRF cavities made of bulk Nb defines the use of asymmetric RF discharge configuration for plasma etching. In a specially designed single cell cavity with sample holders, discharge parameters are combined with etched surface diagnostics to obtain optimum combination of etching rates, roughness and homogeneity in a variety of discharge types, conditions, and sequences. The optimized experimental conditions will ultimately be applied to single cell SRF cavities. |
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| WEPEC083 | Tomographic Analysis of SRF Cavities as Asymmetric Plasma Reactors | 3072 |
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The tomographic reconstruction of local plasma parameters for nonequilibrium plasma sources is a developing approach, which has a great potential in understanding the fundamental processes and phenomena during plasma processing of SRF cavity walls. Any type of SRF cavity presents a plasma rector with limited or distorted symmetry and possible presence of high gradients. Development of the tomographic method for SRF plasma analysis consists of several steps. First, we define the method based on the inversion of the Abel integral equation for a hollow spherical reactor. Second step is application of the method for the actual elliptical cavity shape. Third step consists of study of the effects of various shapes of the driven electrode. Final step consists of testing the observed line-integrated optical emission data. We will show the typical results in each step and the final result will be presented in the form of correlation between local plasma parameter distributions and local etching characteristics. |