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Manoel, F.E.

Paper Title Page
THPEB042 Development of Diffusion Bonding Joints between Oxgen Free Copper and AISI 316L Stainless Steel for Accelerator Components 3975
 
  • R.H.A. Farias, O.R. Bagnato, F. R. Francisco, D.V. Freitas, F.E. Manoel
    LNLS, Campinas
 
 

Diffusion bonding is a welding process where the main mechanism responsible for the union of the materials is the interdiffusion of atoms across the joint surface, even in solid state. The objective of the present work is to produce bonded joints that could be used in vacuum components for particle accelerator. Is this work was produced a welding joint between two dissimilar materials: oxygen free copper and AISI 316 L stainless steel. Each sample was bonded in vacuum (10-5mbar) at a temperature range between 800 and 900°C, pressure of 12MPa and holding times between 30 and 60min. Optical microscopy, scanning electron microscopy, mechanical testing and helium leak test were used to study the bond quality. The images obtained by optical and electron microscopy revealed good quality interfaces without the presence of defects and pores. All samples are tested through the helium leak test and were approved. The results indicate great potential to use this process in the manufacturing of components suitable for ultra high vacuum, for application in the design of new LNLS storage ring.