| Paper |
Title |
Page |
| MOPKF071 |
Study of Row Phase Dependent Skew Quadrupole Fields in Apple-II type EPUs at the ALS
|
479 |
| |
- C. Steier, S. Marks, S. Prestemon, D. Robin, R.D. Schlueter, A. Wolski
LBNL, Berkeley, California
|
|
| |
Since about 5 years, Apple-II type Elliptically Polarizing Undulators (EPU) have been used very successfully at the ALS to generate high brightness photon beams with arbitrary polarization. However, both EPUs installed so far cause significant changes of the vertical beamsize, especially when the row phase is changed to change the polarization of the photons emitted. The effect has been measured in detail and turned out to be caused by a row phase dependent skew quadrupole term in the EPUs. Magnetic measurements revealed the same effect for the third EPU to be installed later this year. All measurements to identify and quantify the effect with beam will be presented, as well as results of magnetic bench measurements and numeric field simulations.
|
|
| THPKF076 |
Plan to Upgrade the Advanced Light Source to Top-off Injection Operation
|
2439 |
| |
- D. Robin, B. J. Bailey, K.M. Baptiste, W. Barry, E. Byrne, J.-Y. Jung, S. Kwiatkowski, R.S. Mueller, H. Nishimura, S. Prestemon, S.L. Rossi, F. Sannibale, D. Schlueter, D. Shuman, C. Steier, G.D. Stover, T. Warwick
LBNL, Berkeley, California
- R.J. Donahue
LBNL/ALS, Berkeley, California
|
|
| |
The brightness and thermal stability of the Advanced Light Source (ALS) is lifetime limited. Brightness improvements such as narrower gap insertion devices, smaller emittance coupling, and higher currents all result in short lifetimes. In addition current changes over a fill impact the thermal stability of both the storage ring and beamlines. In order to mitigate these limitations there is a plan to upgrade the injector of the ALS to full energy injection and to operate in a quasi-continuous filling (Top-Off) injection operation. With Top-Off, the ALS will increase its time-averaged current by two, reduce the vertical emmittance, and operate with smaller gap insertion devices. In this paper we describe our upgrade plan.
|
|